产品质保
从进料收货、制造流程、成品入库至出货检验，皆有完善之管制计划；并应用SPC方法落实执行质量控管，以达到出货零缺点的目标。
产品可靠度
| Process | Table of Contents | Equipment Used |
| Ingot | Oi / ORG / Cs Concentration | FTIR / GFA / SIMS |
| Resistivity / RRG | 4PP / ADE | |
| OISF / Slip Line / Swirl / EPD | Nomarski OM / Spot Light | |
| Crystal and Flat Orientation | X - Ray Diffractometer | |
| Wafering | Wafer flatness ( THK / TIR / STIR / TTV / BOW / WARP / FPD / SFPD ) | ADE |
| Edge Profile | LEP810 | |
| BSD Density | TMS | |
| Poly / LTO Thickness | Filmmeter F50 | |
| Laser Mark Depth | α - step | |
| Surface / Bulk Metal Measurement | ICP - MS / SIMS | |
| Particle / LPD (Size: 0.06~0.5um) | SP1 / CR / KLA - Tencor | |
| Lifetime / Diffusion Length / Fe | SPV | |
| Lifetime / Diffusion Length | µ - PCD | |
| Surface Roughness | AFM | |
| Shelf Life Test | SP1 / ICP - MS | |
| Dimple | Magic Mirror | |
| Epi | Resistivity | Hg - CV / 4PP / SRP |
| Lifetime / Diffusion Length / Fe | SPV | |
| Lifetime / Diffusion Length | µ - PCD | |
| Surface / Bulk Metal Measurement | ICP - MS | |
| Surface Defect / Slip | Slip finder |
失效分析
建立了制程/厂务/设备中的所有失效模式，以便能及早确认制程中所有的致命性与关键性失效发生的可能性，并同时进行矫正行动，如此可预防制程/厂务/设备所潜在的问题点，并使其发生机率降至最低。
